Automatic cleaning equipment is widely used in the field of integrated circuit, advanced packaging in the field of photoresist removal process. Compared with the traditional glue-removing equipment, the degree of automation is higher, using modular design, can be based on customer customized process production needs, from design and development, assembly, testing, equipment installation to after-sales service.

Device Model: SCS-BQ200
Applicable Process: Cleaning, etching, stripping
Cleaning method: cassette less/cassette type
Product Size: 6/8/12 inch,Backward Compatibility
Tank Type: Static/Cyclic
Load/Unload: Standard cassette/Loadport
Process Specifications: particle：0.2um≤30ea,Metal ions：≤5E10atoms/cm2
Software Support: IPC+PLC
MTBF: ≥720h
Wafer Breakage Rate: ≤1/10000
OEE: ≥95%

Integrated circuit field: wafer cleaning Advanced packaging field: TSV etching glue removal process, UBM / RDL glue removal process