Applicable Process: Cleaning, etching, stripping
Product Size: 6/8/12 inch(25/50pcs)
Chamber type: Rotary Spraying
Chamber Count: Customizable
Load/Unload : open cassette
Process Specifications: particle:0.2um≤30ea,Metal ions:≤5E10atoms/cm2
Software Support: IPC+PLC
MTBF: ≥720h
Wafer Breakage Rate: ≤1/10000
OEE: ≥95%
The SRD equipment mainly achieves efficient cleaning and drying through the use of centrifugal force and surface tension controlRotary rinsing and rotary drying,Reduce cross-contamination.
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