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Full-automatic plating equipment
1. Compatible with 12inch and 8inch wafers; 2. Fully automatic operation, foupin-foupout; 3.dry in- dry out; 4.The program can select CU or plating Cu/Sn or plating Au and switch freely; 5. Scan code or RFID sensor automatic selection program, no operator selection; 6.. Stainless steel SUS316 fram... MORE +
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R&d type electroplating machine
Equipment name: Semi-automatic/R&D wafer plating equipment
Equipment series: SP series
Equipment category: R&D type (R)
Process category: Wafer plating
Wafer size: 4-12in... MORE +
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