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Full-automatic wafer plating equipment
Device Model： SCS-CD200
Vertical/Horizontal： Vertical
Single/Double： Single/Double-Sided Plating
Wafer Size： wafer（6/8/12inch）
Adaptation process： RDL、TSV、Bump
Metallic elements： Au，Cu，Ni，Sn，Ag
Technical standards： TSV Max aspect ratio：10:1，RDL Min. Width/Space：5μm*5μm
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R&d type electroplating machine
Equipment name: Semi-automatic/R&D wafer plating equipment
Equipment series: SP series
Equipment category: R&D type (R)
Process category: Wafer plating
Wafer size: 4-12inch
Process type: Au, Cu, Ni, Sn, Ag, Pd, Au/Sn alloy...
Process application: RDL, PillarBump ... MORE +
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