Device Model： SCS-CD200
Vertical/Horizontal： Vertical
Single/Double： Single/Double-Sided Plating
Wafer Size： wafer（6/8/12inch）
Adaptation process： RDL、TSV、Bump
Metallic elements： Au，Cu，Ni，Sn，Ag
Technical standards： TSV Max aspect ratio：10:1，RDL Min. Width/Space：5μm*5μm
Pre- & Post-Processing(As Needed)：Vacuum, Wetting, Cleaning, Drying
Process Tank：Made To Order
Uniformity： wafer level：WiW≤5%

1.Outstanding deep hole/through hole filling capability
2.Higher production capacity and land area efficiency
3.Uniform coating thickness
4.Suitable for specific metal electroplating

RDL, Pillar, Bump, TSV, TGV