Device Model: SCS-SQ200
Applicable Process: Cleaning, etching, stripping
Product Size: 6/8/12 inch
Chamber type: Spray/Soak
Chamber Count: 2/4/8pcs（Customizable）
Load/Unload: open cassette/FOUP/SMIF/EFEM
Process Specifications: particle：0.2um≤30ea,Metal ions：≤5E10atoms/cm2
Software Support: IPC+PLC
MTBF: ≥720h
Wafer Breakage Rate: ≤1/10000
OEE: ≥95%

1.Self-developed intelligent and accurate transmission control system
2.Automatic Centralized Chemical Liquid Supply System (CDS)
3.Liquid overflow design, reduce the amount of single liquid medicine, reduce the cost of use
4. Strong cleaning effect, cleaning yield ≥99%
5. Multiple combinations of wafer cleaning processes are available
6. Particle control ability, ≥0.1μm particles less than 15
7. The liquid medicine tank adopts double tank design, which can realize accurate temperature control
8. Independent control of waste liquid exhaust, effective protection of personnel operations

Integrated circuit field: CMP post-film cleaning, pre-film cleaning, de-gluing cleaning, silicon nitride corrosion, cleaning, epitaxial pre-cleaning。 Advanced packaging areas: TSV post-etching cleaning, UBM/RDL cleaning, bonding cleaning