The single-chip cleaning machine is composed of several cleaning chambers, and then each wafer is sent to each chamber for separate spray cleaning by the manipulator. The cleaning effect is better, avoiding cross contamination and contamination of the previous batch after the batch, and has a high process environment control ability and particle removal ability, effectively solving the problem of cross contamination between wafers. Can be customized 2/4/6/8/12/16 chamber, single chamber processing speed can reach 35 pieces/hour, customized according to customer needs for 8 inch /12 inch silicon wafer cleaning, internal integrated precision chemical liquid matching device and waste liquid recovery device

1.Self-developed intelligent and accurate transmission control system 2.Automatic Centralized Chemical Liquid Supply System (CDS) 3.Liquid overflow design, reduce the amount of single liquid medicine, reduce the cost of use 4. Strong cleaning effect, cleaning yield ≥99% 5. Multiple combinations of wafer cleaning processes are available 6. Particle control ability, ≥0.1μm particles less than 15 7. The liquid medicine tank adopts double tank design, which can realize accurate temperature control 8. Independent control of waste liquid exhaust, effective protection of personnel operations

Integrated circuit field: CMP post-film cleaning, pre-film cleaning, de-gluing cleaning, silicon nitride corrosion, cleaning, epitaxial pre-cleaning。 Advanced packaging areas: TSV post-etching cleaning, UBM/RDL cleaning, bonding cleaning