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Fully automatic horizontal wet etching equipment
The EFEM wafer transfer module is used to realize fully automatic wafer process operation
Features
Device Model: SCS-BQ300
Applicable Process: Cleaning, etching, stripping
Cleaning method: cassette less/cassette type
Product Size: 6/8/12 inch,Backward Compatibility
Tank Type: Static/Cyclic
Load/Unload: Standard cassette/Loadport
Process Specifications: particle：0.2um≤30ea,Metal ions：≤5E10atoms/cm2
Software Support: IPC+PLC
MTBF: ≥720h
Wafer Breakage Rate: ≤1/10000
OEE: ≥95%
Applicable Process: Cleaning, etching, stripping
Cleaning method: cassette less/cassette type
Product Size: 6/8/12 inch,Backward Compatibility
Tank Type: Static/Cyclic
Load/Unload: Standard cassette/Loadport
Process Specifications: particle：0.2um≤30ea,Metal ions：≤5E10atoms/cm2
Software Support: IPC+PLC
MTBF: ≥720h
Wafer Breakage Rate: ≤1/10000
OEE: ≥95%
Application
wafer manufacturing, etc
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