Device Model： SCS-TGVD03
Vertical/Horizontal： Vertical
Single/Double： Double-Sided Plating
Wafer Type and Size： Glass wafer（6/8/12 inch），Glass Panel(310*310/510*515mm)，Glass Thickness: 200um-800um
Adaptation Process： TGV metal filling, surface metallization or RDL
Metallic elements： Cu
Technical standards： Max aspect ratio：2:1-15:1
Pre- & Post-Processing(As Needed)：Vacuum, Wetting, Chemical replenishment, Cleaning, Drying
Process Tank：TGV Cu-filled holes or RDL Cu （customized as needed）
Uniformity： wafer：WiW≤5% ，510*515Panel WiW≤8%

-Cation exchange membranes can reduce the use of additives -Continuous filtration of chemical components -Dry in dry out, low maintenance cost -Custom seal range -High working efficiency -Accurate and consistent flow control -Extremely uniform site profile