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Wafer horizontal plating equipment
Device Model：SCS-SD200
Vertical/Horizontal：Horizontal Single-wafer Electroplating
Single/Double：Single-Sided Plating
Wafer Size：Wafer（6/8/12 inch）
Adaptation process： RDL、TSV、Bump
Metallic elements：Au，Cu，Ni，Sn，Ag
Technical standards：TSV Max aspect ratio：10:1，RDL Min. Width/Space：5μm*5μm
Pre- & Post-Processing(As Needed)：Vacuum, Wetting, Cleaning, Drying
Process chamber：Made To Order
Uniformity：wafer level：WiW≤5%
Vertical/Horizontal：Horizontal Single-wafer Electroplating
Single/Double：Single-Sided Plating
Wafer Size：Wafer（6/8/12 inch）
Adaptation process： RDL、TSV、Bump
Metallic elements：Au，Cu，Ni，Sn，Ag
Technical standards：TSV Max aspect ratio：10:1，RDL Min. Width/Space：5μm*5μm
Pre- & Post-Processing(As Needed)：Vacuum, Wetting, Cleaning, Drying
Process chamber：Made To Order
Uniformity：wafer level：WiW≤5%
Features
Through horizontal electroplating, precise electric field control, modular design, and advanced stirring technology,high uniformity electroplating is achieved while ensuring high production capacity, low pollution and high flexibility
Application
Pillar, Bump, RDL, TSV, etc
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