Recently, SCS (Jiangsu) Semiconductor Equipment Technology Co., Ltd. completed the final inspection, packaging, and sealing of its wafer-level electroplating (cup plating) equipment, which has officially been shipped to an important overseas customer. The successful re-export of this equipment further confirms that SCS's self-developed semiconductor process wafer electroplating equipment has successfully entered the international market, and domestic semiconductor electroplating solutions have gained recognition from overseas markets