Equipment name: Semi-automatic/R&D wafer plating equipment

Equipment series: SP series

Equipment category:  R&D type (R)

Process category: Wafer plating

Wafer size: 4-12inch

Process type: Au, Cu, Ni, Sn, Ag, Pd, Au/Sn alloy... 

Process application: RDL, PillarBump TSV

Process operation: automatic

Wafer type: Si, GaAs, GaN, InP, SiC, Ceramic, Glass...

Wafer size: 2-12inch, shaped wafer

资料添加整理中...

资料添加整理中...