Equipment name: Semi-automatic/R&D wafer plating equipment
Equipment series: SP series
Equipment category: R&D type (R)
Process category: Wafer plating
Wafer size: 4-12inch
Process type: Au, Cu, Ni, Sn, Ag, Pd, Au/Sn alloy...
Process application: RDL, PillarBump TSV
Process operation: automatic
Wafer type: Si, GaAs, GaN, InP, SiC, Ceramic, Glass...
Wafer size: 2-12inch, shaped wafer

资料添加整理中...

资料添加整理中...