Device Model： SCS-HD03
Vertical/Horizontal： Vertical
Single/Double： Double-Sided Plating
Wafer Type and Size： Wafer（6/8/12 inch），Glass Panel（310*310/510*515mm）
Adaptation process： UBM
Metallic elements： Ni、Pd、Au
Technical standards /
Pre- & Post-Processing(As Needed)：Vacuum, Wetting, Cleaning, Drying
Process chamber: Made To Order
Uniformity: wafer level：WiW≤5% ,Panel-Level：WiW≤8%

UBM

* Fully automatic operation, foupin-foupout
* dry in- dry out
* Stainless steel SUS316 skeleton, coated with NPP, strong and corrosion resistant
* Industrial control machine + PLC control, system stability
* Windo ws Operating system, simple and convenient * With the automatic add function