Fully automatic horizontal wet etching equipment

The EFEM wafer transfer module is used to realize fully automatic wafer process operation

Application

wafer manufacturing, etc

Features

Device Model:    SCS-BQ300
Applicable Process:    Cleaning, etching, stripping
Cleaning method:    cassette less/cassette type
Product Size:   6/8/12 inch,Backward Compatibility
Tank Type:   Static/Cyclic
Load/Unload:    Standard cassette/Loadport
Process Specifications:    particle:0.2um≤30ea,Metal ions:≤5E10atoms/cm2
Software Support:   IPC+PLC
MTBF:  ≥720h
Wafer Breakage Rate: ≤1/10000
OEE:  ≥95%

Previous:No data Under:No data