TGV plating equipment

Technical specification:
wafer size:6寸  8寸  12寸
Max board size: 510 x 515
aspect ratio:1:1-20:1
backing material: Glass, quartz
filling material:Cu
glass thickness:100um -800um
Minthrough hole diameter:10um
Hole spacing/diameter:2:1  

Application

Glass through hole

Features

-Cation exchange membranes can reduce the use of additives -Continuous filtration of chemical components -Dry in dry out, low maintenance cost -Custom seal range -High working efficiency -Accurate and consistent flow control -Extremely uniform site profile

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