Device Model：SCS-SD200
Vertical/Horizontal：Horizontal Single-wafer Electroplating
Single/Double：Single-Sided Plating
Wafer Size：Wafer（6/8/12 inch）
Adaptation process： RDL、TSV、Bump
Metallic elements：Au，Cu，Ni，Sn，Ag
Technical standards：TSV Max aspect ratio：10:1，RDL Min. Width/Space：5μm*5μm
Pre- & Post-Processing(As Needed)：Vacuum, Wetting, Cleaning, Drying
Process chamber：Made To Order
Uniformity：wafer level：WiW≤5%

Pillar, Bump, RDL, TSV, etc

Through horizontal electroplating, precise electric field control, modular design, and advanced stirring technology,high uniformity electroplating is achieved while ensuring high production capacity, low pollution and high flexibility